Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials

ABSTRACT

Dielectric compositions comprised of porous polymeric matrices are prepared using nitrogen-containing polymers as pore-generating agents. The compositions are useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric compositions are prepared by admixing a polymeric nitrogenous porogen with a high temperature, thermosetting host polymer in a suitable solvent, heating the admixture to cure the polymer and provide a vitrified matrix, and then decomposing the porogen using heat, radiation, or a chemical reagent effective to degrade the porogen. The highly porous dielectric materials so prepared have an exceptionally low dielectric constant on the order of 2.5 or less, preferably less than about 2.0. Integrated circuit devices and integrated circuit packaging devices manufactured so as to contain the dielectric material of the invention are provided as well.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No. 09/808,726, filed Mar. 14, 2001 now U.S. Pat. No. 6,670,285, the disclosure of which is incorporated by reference in its entirety.

TECHNICAL FIELD

This invention relates generally to dielectric materials and their use in electronic devices such as integrated circuits. More particularly, the invention pertains to the use of nitrogen-containing polymers as pore-generating agents in the preparation of highly porous polymeric matrices having low dielectric constants. The dielectric materials so prepared are useful in a number of contexts, including the fabrication of electronic devices such as integrated circuit devices and integrated circuit packaging devices.

BACKGROUND

As semiconductor devices are becoming smaller and on-chip device density is correspondingly increasing, both signal delays due to capacitive coupling and crosstalk between closely spaced metal lines are increasing. These problems are exacerbated by the need to keep conductor lines as short as possible in order to minimize transmission delays, thus requiring multilevel wiring schemes for the chip. The problems have been ameliorated to some extent by the switch to copper metallurgy, but as feature sizes go below 0.25 μm, this alone will not provide a solution. The use of an insulator with a lower dielectric constant than the currently used SiO₂ (k=3.9–4.2) would also, clearly, improve the situation. Current integration demands for insulators used with, for example, Al(Cu) wiring, also require thermal stabilities in excess of 400° C., good mechanical properties, resistance to crack generation and propagation, low defect densities, low water uptake, chemical resistance, processability by photolithographic techniques and gas phase etching procedures, and capacity for planarization.

Accordingly, considerable attention has focused on the replacement of silicon dioxide with new materials, particularly materials having lower dielectric constants, since both capacitive delays and power consumption depend on the dielectric constant of the insulator. This is not a simple matter given the complexities and demands of current semiconductor integration processes. Of the existing materials with demonstrated ultra-low dielectric constants, the highly fluorinated materials (e.g., Teflon) have the longest history. For example, attempts have been made to reduce the dielectric constant of polyimides by incorporating perfluoroalkyl-containing comonomers into the polymer structure (see, e.g., Haidar et al. (1991) Mater. Res. Soc. Symp. Proc. 227:35; Critchlen et al. (1972) J. Polym. Sci. A-1 10:1789; and Harris et al. (1991) Mater. Res. Soc. Symp. Proc. 227:3). The synthesis of polyimides based on 9,9-disubstituted xanthene dianhydrides, e.g., 6FXDA/6FDA (9,9-bis(trifluoromethoxy)xanthenetetracarboxylic dianhydride/2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane), as well as polyimides based on the TFMOB monomer (2,2′-bis(trifluoromethyl)benzidine), has been reported (see Muraka (March 1996) Solid State Tech 83 and Jang et al. (1994) Mater. Res. Soc. Symp. Proc. 337:25). Although fluorinated alkane polymers such as these have the lowest dielectric constants of any homogeneous polymers and substitution with fluorine decreases the dielectric constant of any polymer, there are many liabilities. Current integration requirements call for exceptional thermal stability at temperatures in the range of 400–450° C. This temperature region is a problem for most organic polymers, and particularly for many fluorocarbons. Also, adhesion of fluorinated materials (self-adhesion, adhesion to metals, dielectrics, ceramics, etc.) is a problem without some prior surface pretreatment. Further, the stability of fluorinated materials due to interaction with interconnect metallurgy at elevated temperatures is problematic. The mechanical properties of many known fluorinated materials (particularly fluoroalkanes) are not ideal; they usually have large thermal expansion coefficients and are intrinsically soft materials. The latter creates a problem for chemical mechanical polishing (CMP) procedures. Finally, the methodology to develop other highly fluorinated materials such as fluorinated polyimides is limited by synthetic difficulties associated with the incorporation of a substantial number of pendant perfluoroalkyl groups.

Attempts have been made to reduce the dielectric constant of such materials through the introduction of kinks and conjugation-interrupting linkages in the polymer backbone to lower molecular polarizability and reduce chain-chain interactions (St. Clair et al. (1988) Proc. Amer. Chem. Soc. Div. Polym. Mater. Sci. Eng. 59:28). A more viable approach, however, has been controlled introduction of porosity into existing low dielectric constant materials.

Generation of porous polymer foams substantially reduces the dielectric constant of the material while maintaining the desired thermal and mechanical properties of the base (or “host”) polymer. The reduction in dielectric constant is achieved by incorporating air voids, as air has a dielectric constant of 1.01. The advantage of a foam approach is illustrated in Hedrick et al. (1995) Polymer 36:2685, which illustrates in graph form a Maxwell-Garnett model of composite structures based on a matrix polymer having an initial dielectric constant of 2.8. Incorporation of a second phase of dielectric constant 1.01, as with the introduction of air-filled pores in a foam, causes a dramatic reduction in the dielectric constant. However, foams provide a unique set of problems for dielectric applications. The pore size must be much smaller than both the film thickness and any microelectronic device features. In addition, the pores are ideally closed cell, i.e., the connectivity between the pores must be minimal to prevent the diffusion of reactive contaminants. Finally, the volume fraction of the voids must be as high as possible to achieve the lowest possible dielectric constant. All of these features can alter the mechanical properties of the film and affect the structural stability of the foam.

An approach that has been developed for preparing a dielectric polymer foam with pore sizes in the nanometer regime involves the use of block copolymers composed of a high temperature, high T_(g) polymer and a second component that can undergo clean thermal decomposition with the evolution of gaseous by-products to form a closed-cell, porous structure. See, e.g., Hedrick et al. (1993) Polymer 34:4717, and Hedrick et al. (1995) Polymer 36:4855. The process involves the use of block copolymers that can undergo thermodynamically controlled phase separation to provide a matrix with a dispersed phase having a roughly spherical equilibrium morphology, monodisperse in size and discontinuous. By using as a host or matrix material a thermally stable polymer of low dielectric constant and, as the dispersed phase, a labile polymer that undergoes thermolysis at a temperature below the T_(g) of the vitrified matrix to yield volatile reaction products, one can prepare foams with pores in the nanometer dimensional regime that have no percolation pathway; they are closed structures with nanometer size pores that contain air.

While the method has proved to be useful in the laboratory, the inventors herein have found formation of porous structures to be problematic in several respects. That is, although the concept was demonstrated in principle (see Hedrick et al. (1993); and Hedrick et al. (1995)), application was complicated by synthetic difficulties and by the extremely small thermal processing window. Also, the thermal stability of the foam product was limited to about 350–375° C. for thermoplastic hosts (Hedrick et al. (1996) J. Polym. Sci.; Polym. Chem. 34, 2867). Furthermore, although dielectric constants of 2.2–2.4 were achieved at porosity levels less than about 20% (see Hedrick et al. (1996)), the pore volume could not be further increased without compromising the small domain sizes and/or the non-interconnectivity of the pore structure.

In U.S. Pat. No. 5,953,627 to Carter et al., also assigned to International Business Machines Corporation (Armonk, N.Y.), low molecular weight amines are described as processing aids and toughening agents to improve the mechanical properties of silsesquioxane films. However, when low molecular weight amines are used as toughening agents or as pore-generating agents (or “porogens”), e.g., in the preparation of organosilicate dielectric materials, formulation stability is lacking and unwanted gelation often occurs within a very short period of time (on the order of hours). U.S. Pat. No. 6,107,357 to Hawker et al., also assigned to International Business Machines Corporation, describes the use of polymeric porogens in the preparation of porous dielectric materials, and while the process is effective, the range of nanoporosities that can be obtained is somewhat limited; that is, the void percentage in the porous product is limited to about 35%.

The present invention provides a novel method for preparing highly porous, low dielectric constant materials comprised of porous matrices with a significantly increased range of obtainable void volumes, wherein the matrices can contain non-interconnected, “closed cell” pores or open celled highly porous channels in the form of sharply defined domains. Typically, the pores and/or porous channels are less than about 500 Å in diameter, preferably less than about 200 Å in diameter, more preferably less than about 100 Å. The porous matrices have very low dielectric constants (on the order of 2.0–2.2, or even lower), are thermally stable at temperatures in excess of about 400° C., preferably greater than about 450° C., and are readily processable by current fabrication techniques, including reactive ion etching (RIE), CMP, and high temperature annealing. The spinning solutions maintain a relatively low viscosity (less than about 10.0 cp) over an extended period (up to 30 days or more). The method involves the use of various nitrogen-containing polymers as pore-generating agents. In view of the problems with formulation stability and gelation encountered by using lower molecular weight, basic nitrogenous molecules in dielectric films, i.e., as in U.S. Pat. No. 5,953,627 to Carter et al., it is indeed surprising that nitrogenous polymers would provide excellent formulation stability. The nitrogenous porogenic polymers are useful not only in the preparation of highly porous, low dielectric constant materials, but also in the preparation of substantially defect-free dielectric coatings, and as toughening agents and coating stabilizers.

SUMMARY OF THE INVENTION

Accordingly, it is a primary object of the invention to address the above-mentioned need in the art by providing a method for using nitrogenous polymers as porogens in the preparation of highly porous polymeric matrices suitable as low dielectric constant materials.

It is another object of the invention to provide such a method wherein the porous polymeric matrix so prepared is comprised of an organosilicate.

It is still another object of the invention to provide a dielectric material prepared using the aforementioned process.

Additional objects, advantages and novel features of the invention will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention.

The invention thus provides, in one embodiment, a method for making a dielectric material comprised of a highly porous material having an average pore size of less than about 500 Å in diameter, preferably less than about 200 Å in diameter, more preferably less than about 100 Å in diameter, a void percentage in the range of approximately 65% to 95%, preferably 70% to 95%, and a dielectric constant of less than about 2.5, preferably less than about 2.0. The method involves: (a) admixing (i) a decomposable porogen comprised of a nitrogenous polymer preferably containing a plurality of nitrogenous monomer units, the polymer typically although not necessarily having a number average molecular weight M_(n) of at least about 1000 g/mol, and (ii) a silicon-containing, high temperature thermosetting host polymer, in (iii) a solvent for the porogen and host polymer; (b) heating the admixture (e.g., a film prepared from the admixture) to a temperature effective to cure the host polymer and provide a vitrified, two-phase polymeric matrix composed of the cured host polymer and the porogen; and (c) decomposing the porogen. The specific method employed to bring about porogen decomposition will depend upon the nature of the porogen, as the porogen may be thermally decomposable, radiation decomposable, or chemically decomposable. For a thermally decomposable porogen, the vitrified, two-phase matrix is heated to a temperature effective to degrade the porogen without affecting the vitrified host polymer (the curing temperature in step (b) is necessarily lower than the porogen degradation temperature). For a radiation decomposable porogen, the vitrified two\phase matrix is exposed to radiation effective to degrade the porogen. For a chemically decomposable porogen, the vitrified two-phase matrix is treated with a chemical reagent suitable to degrade the porogen without otherwise affecting the coating. Optionally, a coupling agent may be introduced into the admixture prepared in step (a), wherein the coupling agent is capable of promoting crosslinking of the porogen, chemical incorporation of the porogen into the host polymer, and possibly crosslinking of the host polymer as well. In addition, a basic catalyst (e.g., an amine or a Bronsted base) may be used to lower the required curing temperature in step (c), but is also optional and is generally not preferred.

In a further embodiment, a novel dielectric material is provided that comprises a porous material having an average pore size of less than about 500 Å in diameter, preferably less than about 200 Å in diameter, more preferably less than about 100 Å in diameter, a void percentage in the range of approximately 65% to 95%, preferably 70% to 95%, a dielectric constant of less than 2.5, preferably less than about 2.0, wherein the porous material is comprised of a vitrified host polymer that has a pre-process number average molecular weight M_(n) in the range of approximately 750 to 100,000 g/mol, and that (after vitrification) is thermally stable at temperatures of at least about 400° C., preferably temperatures of at least about 450° C.

In a further embodiment of the invention, an integrated circuit device is provided that comprises: (a) a substrate; (b) individual metallic circuit lines positioned on the substrate; and (c) a dielectric coating positioned over and/or between the individual metallic circuit lines, the coating comprising the highly porous, low dielectric constant material of the invention.

Still an additional embodiment of the invention relates to an integrated circuit packaging device providing signal and power current to an integrated circuit chip, the packaging device comprising:

(i) a substrate having electrical conductor means for connection to a circuit board,

(ii) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least one of the electrically insulating layers is comprised of the highly porous, low dielectric constant material as provided herein; and

(iii) a plurality of vias for electrically interconnecting the electrical conductor, the conducting layers and the integrated circuit chip.

It will be appreciated by those skilled in the art that the dielectric materials of the invention are useful in a variety of contexts, however, and the invention is not limited in this regard. For example, substrates coated with the dielectric material of the invention are not only useful in integrated circuit applications, but can also serve as porous separation media and as “biochips,” i.e., miniaturized supports to be used in the binding and/or assaying of large quantities of biological molecules such as peptides, proteins, oligonucleotides, polynucleotides, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a high magnification optical photomicrograph illustrating a defect-free methylsilsesquioxane (MSSQ) coating prepared using the method of the invention.

FIGS. 2A and 2B are high magnification and low magnification optical photomicrographs, respectively, illustrating defects in a coating of neat MSSQ resin near the edge of a wafer, while FIG. 2C is a high magnification optical photomicrograph illustrating defects in a coating of neat MSSQ resin at the center of a wafer.

FIG. 3 is a graph illustrating the change in viscosity over time of an MSSQ coating solution containing dimethylamino ethyl isobutyrate, dimethylamino ethanol, and a poly(methyl methacrylate-co-dimethylaminoethyl methacrylate) (poly(MMA-DMAEM)) copolymer as porogens.

FIG. 4 is a cross-sectional view of a portion of an integrated circuit device fabricated using the novel dielectric materials provided herein.

FIGS. 5–8 schematically illustrate a process for making an integrated circuit device using the present dielectric materials.

FIGS. 9–11 schematically illustrate an alternative process for making an integrated circuit device using the present dielectric materials.

DETAILED DESCRIPTION OF THE INVENTION

Definitions and Overview

Before describing the present invention in detail, it is to be understood that this invention is not limited to specific porogens, host polymers, or process steps, as such may vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.

It must be noted that, as used in this specification and the appended claims, the singular forms “a,” “and,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a porogen” includes mixtures of porogens, a “host polymer” includes combinations of host polymers, “a solvent” includes mixtures of solvents, and the like.

In describing and claiming the present invention, the following terminology will be used in accordance with the definitions set out below.

The term “alkyl” as used herein refers to a branched or unbranched saturated hydrocarbon group of 1 to approximately 24 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, octyl, decyl, tetradecyl, hexadecyl, eicosyl and tetracosyl, as well as cycloalkyl groups such as cyclopentyl and cyclohexyl. The term “lower alkyl” intends an alkyl group of 1 to 6 carbon atoms, and thus includes methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, cyclopentyl, n-hexyl, cyclohexyl, etc.

The term “alkylene” as used herein refers to a difunctional saturated branched or unbranched hydrocarbon chain containing from 1 to approximately 24 carbon atoms, typically 1 to approximately 12 carbon atoms, and includes, for example, methylene (—CH₂—), ethylene (—CH₂—CH₂—), propylene (—CH₂—CH₂—CH₂—), 2-methylpropylene (—CH₂—CH(CH₃)—CH₂—), hexylene (—(CH₂)₆—), and the like. “Lower alkylene,” as in the lower alkylene linkage of the optional coupling agent herein, refers to an alkylene group of 1 to 6, more preferably 1 to 4, carbon atoms.

The term “alkoxy” as used herein refers to a substituent —O—R wherein R is alkyl as defined above. The term “lower alkoxy” refers to such a group wherein R is lower alkyl as defined above, e.g., methoxy, ethoxy and the like.

The term “aryl” as used herein, and unless otherwise specified, refers to an aromatic moiety containing 1 to 5 aromatic rings. For aryl groups containing more than one aromatic ring, the rings may be fused or linked. Aryl groups are optionally substituted with one or more inert, nonhydrogen substituents per ring; suitable “inert, nonhydrogen” substituents include, for example, halo, haloalkyl (preferably halo-substituted lower alkyl), alkyl (preferably lower alkyl), alkenyl (preferably lower alkenyl), alkynyl (preferably lower alkynyl), alkoxy (preferably lower alkoxy), alkoxycarbonyl (preferably lower alkoxycarbonyl), carboxy, nitro, cyano and sulfonyl. Unless otherwise indicated, the term “aryl” is also intended to include heteroaromatic moieties, i.e., aromatic heterocycles. Generally, although not necessarily, the heteroatoms will be nitrogen, oxygen or sulfur.

The term “halo” is used in its conventional sense to refer to a chloro, bromo, fluoro or iodo substituent. In the reagents and materials described and claimed herein, halo substituents are generally fluoro or chloro. The terms “haloalkyl,” “haloaryl” (or “halogenated alkyl” or “halogenated aryl”) refer to an alkyl or aryl group, respectively, in which at least one of the hydrogen atoms in the group has been replaced with a halogen atom.

The term “hydrocarbyl” is used in its conventional sense to refer to a hydrocarbon group containing carbon and hydrogen, and may be aliphatic, alicyclic or aromatic, or may contain a combination of aliphatic, alicyclic and/or aromatic moieties. The hydrocarbyl substituents herein generally contain 1 to 24 carbon atoms, more typically 1 to 12 carbon atoms, and may be substituted with various substituents and functional groups.

The term “polymer” is used to refer to a chemical compound that comprises linked monomers, and that may or may not be linear, crosslinked or thermosetting.

The term “miscible” refers to two (or more) polymers that when mixed and processed as a film give rise to a composition having a single glass transition temperature T_(g), and further that this is the case over a broad compositional range, i.e., in a composition comprised of anywhere from about 5 to 95 wt. % of a first polymer and, correspondingly, from about 95 to 5 wt. % of a second polymer. In some cases, i.e., when used to prepare defect-free dielectric coatings, the nitrogenous porogen and the host polymer herein are “miscible” with respect to each other over the aforementioned compositional ranges.

The term “substantially defect-free” refers to a coating on a substrate that has fewer than ten defects in an 8″ wafer (i.e., a circular wafer with an 8″ diameter). Such coatings are also referred to herein as “defect-free,” but it is to be understood that the coatings are not necessarily 100% free of defects.

In a first embodiment, the invention provides a process for preparing a low dielectric constant, porous polymeric matrix. The process enables preparation of a thermally and chemically stable porous material with a high void percentage, on the order of 65% to 95%, generally on the order of 70% to 95%, with pores less than about 500 Å in diameter, preferably less than about 200 Å in diameter, more preferably less than about 100 Å in diameter, and a dielectric constant less than about 2.5, optimally less than about 2.0.

The process involves, at the outset, admixing, in a suitable solvent, (i) a thermally decomposable, radiation decomposable or chemically decomposable porogen comprised of a nitrogenous polymer, typically containing a plurality of nitrogenous monomer units, the polymer generally although not necessarily having a number average molecular weight M_(n) of at least about 1000 g/mol, (ii) a silicon-containing, high temperature thermosetting host polymer, or a precursor to such a polymer, and optionally (iii) a coupling or “crosslinking” agent effective to crosslink the porogen, promote incorporation of the porogen into the host polymer, and possibly crosslink the host polymer and optionally the porogen as well. Admixture is generally although not necessarily carried out by first dissolving the host polymer or a precursor thereto in the solvent, followed by addition of the porogen. Admixture will typically be carried out at room temperature. If a dielectric coating is to be prepared, the admixture is then deposited as a coating layer on a substrate surface, e.g., the surface of a silicon wafer. In the next step of the process, the admixture is heated to a temperature effective to partially or fully cure the host polymer and provide a vitrified, two-phase polymeric matrix in which all or substantially all of the porogen is present as a discrete phase within a continuous phase formed by the host polymer. This initial heating step is carried out at a temperature below the decomposition temperature of the porogen, typically at a temperature in the range of approximately 150° C. to about 250° C., preferably 200° C. to about 250° C. Next, if the porogen is thermally decomposable, the porogen is thermally degraded by heating to a higher temperature, i.e., a temperature that is higher than the thermal decomposition temperature of the porogen, but not so high that chemical modification, physical modification, or decomposition of the vitrified host polymer would result. If the porogen is radiation decomposable, the vitrified matrix is exposed to radiation effective to decompose the porogen; the radiation may be ultraviolet, x-ray, electron beam, or the like. Analogously, if the porogen is chemically decomposable, the vitrified matrix may be treated with a chemical reagent effective to chemically degrade the porogen. Thermal, radiation-induced, and chemical decomposition cause the porogen to decompose to volatile fragments that diffuse out of the rigid matrix of the host polymer, leaving closed cell pores or open channels (depending on void volume) present throughout. The pore size in this resulting porous matrix will generally be similar in size relative to the domains of the porogen in the vitrified two-phase matrix.

The Host Polymer

As noted above, the present process involves the use of a high temperature thermosetting host polymer. Generally, the host polymer is a silicon-containing polymer, or a precursor to such a polymer, preferably organic polysilica, and has a number average molecular weight M_(n) typically in the range of about 750 to about 100,000 g/mol. For simplicity, the term “host polymer” is used herein to refer to the polymer per se as well as to precursors to the host polymer (e.g., uncondensed alkoxysilanes or organically modified silicates, which are actually precursors to polysilica).

Organic polysilica is a polymeric compound comprising silicon, carbon, oxygen and hydrogen atoms. Suitable organic polysilica include (i) silsesquioxanes, (ii) alkoxy silanes, preferably partially condensed alkoxysilanes (e.g., partially condensed by controlled hydrolysis of tetraethoxysilane having an M_(n) of about 500 to 20,000), (iii) organically modified silicates having the composition RSiO₃ and R₂SiO₂ wherein R is an organic substituent, and (iv) orthosilicates, preferably partially condensed orthosilicates having the composition Si(OR)₄. As is known in the art, silsesquioxanes are polymeric silicate materials of the type (RSiO_(1.5))_(n) where R is an organic substituent. Combinations of two or more different organic polysilicas may also be used.

Suitable organic polysilica for use in the present invention will be known to those skilled in the art, and/or are described in the pertinent texts, patents and literature. See, for example, U.S. Pat. No. 5,384,376 to Tunney et al., U.S. Pat. No. 6,107,357 to Hawker et al., and U.S. Pat. No. 6,143,643 to Carter et al., and Chem. Rev. 95:1409–1430 (1995). Preferably, the organic polysilica is a silsesquioxane. Suitable silsesquioxanes for the present invention include, but are not limited to, hydrogen silsesquioxanes, alkyl (preferably lower alkyl, e.g., methyl) silsesquioxanes, aryl (e.g., phenyl) or alkyl/aryl silsesquioxanes, and copolymers of silsesquioxanes (e.g., copolymers of polyimides and silsesquioxanes). The silsesquioxanes are commercially available, e.g., as glass resins of the GR series (GR100, GR150, GR650, GR950, etc.) from Techniglass, Perrysburg, Ohio.

The Porogen

The porogen is a thermally degradable, photochemically degradable, or chemically decomposable nitrogenous polymer generally comprised of a plurality of nitrogenous monomer units, which upon exposure to radiation, heat or an appropriate chemical reagent, decomposes quantitatively into non-reactive species that can readily diffuse through the host polymer matrix. With a thermally degradable porogen, the temperature at which decomposition occurs should be sufficiently high to permit standard film preparation yet be below the temperature at which the host polymer would be chemically modified, physically modified, or degraded. Thermally degradable porogens used herein will generally although not necessarily have a decomposition temperature less than about 450° C., typically in the range of about 300° C. to about 400° C., and preferably in the range of about 350° C. to about 400° C. For radiation-decomposable porogens, the vitrified two-phase matrix is exposed to radiation effective to decompose the porogen; the radiation may be ultraviolet, x-ray, electron beam, or the like. Analogously, if the porogen is chemically decomposable, the vitrified matrix may be treated with a chemical reagent effective to chemically degrade the porogen. For example, acids and bases may be used to degrade acid-decomposable and base-decomposable porogens, respectively.

A wide range of nitrogenous polymers may be used, providing that the polymer has a suitable decomposition temperature. Suitable nitrogenous polymers include linear, branched and crosslinked polymers, including crosslinked polymeric nanoparticles (typically 2 to 100 nm in diameter, preferably 5 to 20 nm in diameter). “Branched” polymers include hyperbranched polymers (containing two or more generations of branching) and dendrimeric polymers. In contrast to hyperbranched polymers, dendrimers are regularly branched macromolecules with a branch point at each repeat unit. Also, hyperbranched polymers are obtained via a polymerization reaction, while most regular dendrimers are obtained by a series of stepwise coupling and activation steps. Examples of dendrimers include the polyamidoamine (PAMAM) Starburst™ dendrimers of Tomalia et al. (1985) Polym. J. 17:117 and the convergent dendrimers of Hawker et al. (1990) J. Am. Chem. Soc. 112:7638. Linear polymers, however, are preferred.

The nitrogen-containing functionalities of the polymeric porogen may be, for example, any one or a combination of the following:

primary amino (—NH₂) groups;

mono-substituted (secondary) amino groups —NHR where R is hydrocarbyl, generally either alkyl or aryl, e.g., lower alkyl or phenyl, and may be substituted with one or more nonhydrocarbyl substituents, e.g., 1 to 3 halo, hydroxyl, thiol, or lower alkoxy groups (such —NHR groups include, for example, methylamino, ethylamino, isopropylamino, butylamino, cyclopropylamino, cyclohexylamino, n-hexylamino, phenylamino, benzylamino, chloroethylamino, hydroxyethylamino, etc.);

di-substituted (tertiary) amino groups —NR¹R² where R¹ and R² may be the same or different and are as defined above for R (suitable —NR¹R² include, for example, dimethylamino, diethylamino, diisopropylamino, dibutylamino, methylpropylamino, methylhexylamino, methylcyclohexylamino, ethylcyclopropylamino, ethylchloroethylamino, methylbenzylamino, methylphenylamino, methyltoluylamino, methyl-p-chlorophenylamino, methylcyclohexylamino, etc.);

amides —(CO)—NR³R⁴ where R³ and R⁴ may be the same or different and are either hydrogen or R, wherein R is as defined above (including, for example, amides wherein one of R³ and R⁴ is H and the other is methyl, butyl, benzyl, etc.);

cyano (—C≡N);

aromatic nitrogen-containing heterocycles, typically five- or six-membered monocyclic substituents, or bicyclic fused or linked five- or six-membered rings (such as pyrrolyl, pyrrolidinyl, pyridinyl, quinolinyl, indolyl, pyrimidinyl, imidazolyl, 1,2,4-triazolyl, tetrazolyl, etc.);

non-aromatic nitrogen-containing heterocycles, typically four- to six-membered rings, including lactams and imides, e.g., pyrrolidino, morpholino, piperazino, piperidino, N-phenyl-β-propiolactam, γ-butyrolactam, ε-caprolactam, acetimide, phthalimide, succinimide, etc.; and

nitrogenous backbone functionalities such as —NR⁵— where R⁵ is hydrogen or as defined for R, wherein R is defined above, and imine linkages —N═.

For example, typical nitrogenous porogens for use herein may be polymerized from one or more of the following monomers: acrylamide; methacrylamide; acrylonitrile; methacrylonitrile; acrylates and methacrylates substituted with a primary, secondary or tertiary amino group optionally bound through a lower alkylene linker (e.g., dimethylaminoethyl methacrylate); 2-, 3- or 4-vinyl pyridines, typically 2- and 4-vinyl pyridine; vinyl 2-pyrrolidinone; N,N-dialkylaminoalkyl methacrylates, typically where the alkyl substituents are lower alkyl (e.g., N,N-dimethylaminoethyl methacrylate); o-, m-, and p-aminostyrene; and N-substituted o-, m-, and p-aminostyrene (e.g., substituted with an a lower alkyl or lower alkylamino group). The foregoing list is intended to be illustrative and not limiting with regard to possible nitrogen-containing monomers that can be used in the preparation of suitable polymeric porogens herein.

Exemplary nitrogenous polymers suitable for use as the porogen in the present process include, but are not limited to: poly(acrylamide); poly(methacrylamide); N,N-dialkyl poly(acrylamide) (particularly wherein the nitrogen-bearing substituents are C₁–C₁₂ alkyl); N,N-dialkyl poly(methacrylamide) (again, particularly wherein the nitrogen-bearing substituents are C₁–C₁₂ alkyl); poly(alkoxylated polyamide) (e.g., N-methoxymethylated polyamide and hydroxyethylated polyamide); poly(ε-caprolactam); polypropiolactam; polycapryllactam; polylauryllactam; poly(pyrrolidin-2-one); poly(vinylamine); poly(vinyl pyrrolidone); poly(2-vinylpyridine); poly(3-vinylpyridine); poly(4-vinylpyridine); poly(o-aminostyrene); poly(m-aminostyrene); poly(p-aminostyrene); polyethyleneimine; N-alkylated polyethyleneimine (particularly polyethylene imine alkylated with a C₁–C₁₂ alkyl substituent); N-acylated polyethylene imine (again, where the nitrogen-bearing substituents are C₁–C₁₂); poly(p-phenylene terephthalamide); polyetherimides; polyimides; polyurethanes; polyhydrazides; polybenzimidazole; poly(1,2,4-triazole); polyhydantoin; polyimidines; and copolymers thereof or with other polymeric species (e.g., poly(styrene-co-acrylonitrile) and poly(butadiene-co-acrylonitrile)).

Copolymers of non-nitrogenous monomers and nitrogenous monomers can also be advantageously employed. Suitable non-nitrogenous comonomers include, but are not limited to, the following ethylenically unsaturated polymerizable monomers: acrylic and methacrylic acid esters and amides, including alkyl acrylates, aryl acrylates, alkyl methacrylates and aryl methacrylates (for example, methyl acrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, t-butyl acrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, benzyl acrylate and N-phenylacrylamide). The ratio of non-nitrogenous monomer units to nitrogenous monomer units will generally be in the ratio of about 1:99 to 99:1, preferably about 1:10 to 10:1, more preferably about 1:5 to 5:1, and most preferably about 1:1 to 5:1.

For example, copolymers of acrylate monomers such as methyl methacrylate and a comonomer having pendant amino groups have been found to be optimal. One such copolymer is poly(methyl methacrylate-co-dimethylaminoethyl methacrylate) (poly(MMA-DMAEM), wherein the ratio of MMA to DMAEM is in the range of about 1:1 to 5:1, optimally about 3:1; see Example 1.

Also suitable are polymers that can be obtained commercially in the form of nanoparticles, i.e., particles having an average diameter in the range of about 5 nm to 100 nm. Such particulate nitrogenous polymers are available, for example, from Rohm & Haas.

The number average molecular weight M_(n) of the nitrogenous polymer is generally at least about 1000 g/mol, preferably at least about 6000 g/mol, and can be as high as 80,000 g/mol or more. Preferably, the M_(n) is in the range of about 6000 to 50,000 g/mol, more preferably in the range of about 6000 to 30,000 g/mol, most preferably in the range of about 6000 to 15,000 g/mol.

Coupling Agents

As noted previously, a coupling agent may be used to crosslink the porogen, promote incorporation of the porogen into the host polymer, and possibly crosslink the host polymer as well. The coupling agent is optional, and will generally be used only when a higher degree of crosslinking is desired or necessary than is obtainable without a coupling agent, or when the porogen is to be covalently coupled to the host polymer. Suitable coupling agents have one or more functional groups at each terminus, each functional group capable of covalently binding to the porogen, and optionally to the host polymer as well. Thus, the molecular structure of the coupling agent may be represented as R⁶-L-R⁷ wherein R⁶ and R⁷ are functional groups that enable covalent binding to reactive sites on another molecular moiety, e.g., the porogen, and L is a hydrocarbylene linker containing at least two carbon atoms.

The coupling agent may bind to the porogen and optionally the host polymer via any chemical mechanism that results in covalent attachment. For coupling to porogens that contain hydroxyl or free amino groups as nucleophilic sites, R⁶ and/or R⁷ are functional groups that enable covalent binding to such nucleophilic moieties. Examples of such functional groups include, but are not limited to, isocyanates, ketenes, cyano, imino ethers, carbodiimides, aldehydes, ketones, or the like.

For binding to the host polymer, R⁶ and/or R⁷ are typically selected to enable covalent attachment to Si—OH groups of the organic polysilica. Preferred R⁶ and/or R⁷ moieties in this case have the structural formula —SiX₃ wherein the X substituents may be the same or different, and are either leaving groups or inert hydrocarbyl moieties, with the proviso that at least one of the X substituents must be a leaving group. Typically, the leaving groups are hydrolyzable so as to form a siloxane (—Si—O—) linkage with a hydroxyl group present on the host polymer. Examples of suitable leaving groups include, but are not limited to, halogen atoms, particularly chloro, and alkoxy moieties, particularly lower alkoxy moieties. When all three X substituents are leaving groups, —SiX₃ will then be, for example, trichlorosilyl, trimethoxysilyl, triethoxysilyl, or the like. If an inert hydrocarbyl substituent is present, it is generally a lower alkyl group, e.g., methyl, ethyl, isopropyl, n-propyl, t-butyl, etc. Thus, —SiX₃ may also be diisopropylchlorosilyl, dimethylchlorosilyl, ethyldichlorosilyl, methylethylchlorosilyl, or the like. Other R⁶ and/or R⁷ moieties will be appropriate for other host polymers, as will be appreciated by those skilled in the art.

The linker L between R⁶ and R⁷ is hydrocarbylene, typically C₂–C₂₄ hydrocarbylene, including, but not limited to, alkylene, arylene, and alkyl ether linkages, optionally substituted with one or more, typically one or two, lower alkyl, halogen, aryl, or other substituents. Particularly preferred L moieties are unsubstituted C₂–C₁₂ alkylene linkages, with C₂–C₆ alkylene linkages most preferred, and n-propylene and n-butylene being particularly optimal.

If a coupling agent is used, the coupling agent and porogen are optimally present in an approximately 1:1 ratio, and temperatures in the range of about 25° C. to about 150° C. are usually sufficient to effect crosslinking.

Matrix Preparation/Vitrification and Decomposition of the Porogen

Preparation of the porous dielectric material using the method invention involves, as noted earlier herein, preparation and vitrification of a two-phase polymeric matrix composed of the host polymer and the porogen, followed by decomposition of the porogen using heat, radiation, or a chemical reagent effective to degrade the porogen.

The two-phase polymeric matrix is prepared and cured as follows. The selected porogen and the host polymer are admixed at approximately room temperature in a suitable high boiling point solvent, e.g., N-methylpyrrolidone, dimethylacetamide, dimethylphenyl urea, butyl acetate, 2-ethoxyethanol, cyclohexanone, γ-butyrolactone, ethyl lactate, ethoxyethylpropionate (EEP), alkylene glycol alkyl ether esters such as propylene glycol methyl ether acetate (PGMEA), and alkylene glycol alkyl ethers such as propylene glycol methyl ether (PGME) and propylene glycol n-propyl ether (PGn-PE).). A catalyst, generally a basic catalyst such as an amine or a Bronsted base (e.g., N-methyldiethanolamine) may be added in order to lower the curing temperature in the next step of the process. Generally, however, a basic catalyst is not used since silsesquioxane polymers tend to be unstable in the presence of low molecular weight bases (thus, if a basic catalyst is employed, the next step of process must be carried out immediately). The solids content of the solution is generally about 10 wt. % to 60 wt. %, preferably about 30 wt. % to 40 wt. %, with the relative quantities of porogen and host polymer selected to result in a vitrified matrix in which the porogen represents approximately 65 vol. % to 95 vol. % thereof, preferably 70 vol. % to 95 vol. %. This solution may be used to prepare the dielectric coating immediately after preparation, or it may be stored, as in the absence of a low molecular weight base, the solution is surprisingly stable for the extended periods of time typically required in the industry.

The dielectric material prepared from the solution may be a coating, although the material can be used in other contexts as well. In preparing a dielectric coating, the aforementioned solution is used to coat the surface of a substrate such as may be made of, for example, silicon, silicon dioxide, silicon-germanium, glass, silicon nitride and other ceramics, aluminum, copper and gallium arsenide. Other suitable substrates will be known to those of ordinary skill in the art. In a multilayer integrated circuit device, an underlying layer of insulated, planarized circuit lines can also function as a substrate. If the nitrogenous porogen and the host polymer are miscible with respect to each other within the compositional range used to prepare the two-phase matrix, i.e., if the porogen and host polymer have a single glass transition temperature T_(g) in the admixture, the dielectric coating prepared can be made substantially defect-free as described in copending, commonly assigned U.S. patent application Ser. No. 09/808,724, for “Defect-Free Dielectric Coatings and Preparation Thereof Using Polymeric Nitrogenous Porogens” (also to Hawker et al.), filed on even date herewith.

In the next step of the process, the admixture, i.e., the uncured admixture of the host polymer and porogen, is heated to a temperature effective to partially or fully cure the host polymer (e.g., by condensing organic polysilica) and provide a vitrified, two-phase polymeric matrix in which the porogen is present as a as a discrete or substantially discrete phase within a continuous phase formed by the host polymer. This initial heating step is carried out at a temperature below the decomposition temperature of the porogen, typically at a temperature in the range of approximately 150° C. to about 250° C., preferably 200° C. to about 250° C. Heating may be carried out directly or in a step-wise fashion (e.g., 200° C. for 2 hrs and then ramped up at 5° C./min to 250° C. and held for 2 hrs). Surface properties of the cured coating may be altered depending on curing atmosphere. For example, curing under nitrogen will yield a hydrophobic coating, while curing in an oxygen-containing atmosphere such as air will give rise to a hydrophilic coating (as will curing using an electron beam).

The final step of the process involves decomposing the porogen dispersed within the continuous matrix of the host polymer, e.g., the condensed, rigid organic polysilica. Photochemically labile porogens can be decomposed by exposure of the composition to radiation effective to bring about decomposition, e.g., ultraviolet, x-ray, electron beam, or the like. If the porogen is thermally decomposable, degradation may be accomplished by heating the composition to a temperature at or above the thermal decomposition temperature of the polymer, but below a temperature that would result in chemical modification, physical modification, or decomposition of the vitrified host polymer. If the porogen is chemically decomposable, the cured coating may be treated with a chemical reagent effective to degrade the porogen. Thermal, chemical or radiation-induced decomposition causes the porogen to decompose into fragments that diffuse out of the rigid matrix of the host polymer, leaving pores present throughout. The pore size in this resulting porous matrix will generally be similar in size relative to the size of the domains of the porogen in the vitrified two-phase matrix. Pore size may be altered, if desired, by varying the molecular weight, degree of functionalization, and/or relative concentration of the porogen. That is, actual pore diameters depend on many parameters, including porogen molecular weight, resin structure, and loading level. In general, pore diameters increase with porogen loading level and porogen molecular weight. In addition, for a given porogen, molecular weight and loading level, the porous morphology may vary to some extent with respect to the chemical structure of the resin (for example, the pore sizes obtained for Techniglass GR-650 and Hitachi HSQ RZ25 methyl silsesquioxanes are comparable, but are at least a factor of two larger when Dow Coming DC-15K methyl silsesquioxane is used).

The Novel Dielectric Material

The dielectric material prepared using the methodology described in the preceding section has a number of advantageous properties. The material has extremely small closed cell pores and/or channels, generally less than about 50 nm (i.e., less than about 500 Å), preferably less than about 20 nm (i.e., less than about 200 Å), most preferably less than about 10 nm (i.e., less than about 100 Å) in diameter, and a void percentage in the range of approximately 65% to 95%, generally in the range of approximately 70% to 95%. The small pore size and the high void percentage provide the material with an exceptionally low dielectric constant, less than about 2.5, preferably less than less than about 2.0, at 25° C. In addition, when used to prepare coatings, a miscible porogen and host polymer will give rise to dielectric coatings that are virtually defect-free. The novel dielectric material also has a low thermal expansion coefficient at elevated temperatures, which assists in avoiding film cracking during thermal processing. Further, the dielectric material has mechanical properties that enable it to be chemically/mechanically planarized to facilitate lithographic formation of multiple circuit levels in multilevel integrated circuit devices. The dielectric material is optically clear and adheres well to substrates, and is useful not only in integrated circuit technology but also in metallurgy, sensor applications, biotechnology, separation science, and other fields.

Integrated Circuit Devices

One use of the novel dielectric compositions is in the manufacture of electronic devices, particularly integrated circuit devices. An integrated circuit device according to the present invention is exemplified in FIG. 4, wherein the device is shown as comprising substrate 2, metallic circuit lines 4, and a dielectric material 6 of the present invention. The substrate 2 has vertical metallic studs 8 formed therein. The circuit lines function to distribute electrical signals in the device and to provide power input to and signal output from the device. Suitable integrated circuit devices generally comprise multiple layers of circuit lines that are interconnected by vertical metallic studs.

Suitable substrates 2 comprise silicon, silicon dioxide, silicon-germanium, glass, silicon nitride and other ceramics, aluminum, copper, or gallium arsenide. Suitable circuit lines generally comprise a metallic, electrically conductive material such as copper, aluminum, tungsten, gold or silver, or alloys thereof. Optionally, the circuit lines may be coated with a metallic liner such as a layer of nickel, tantalum or chromium, or with other layers such as barrier or adhesion layers (e.g., SiN, TiN, or the like).

The invention also relates to processes for manufacturing integrated circuit devices containing a dielectric composition as described and claimed herein. Referring to FIG. 5, the first step of one process embodiment involves disposing on a substrate 2 a layer 10 of an admixture of the polymeric nitrogenous polymer and the host polymer or a precursor thereto in a suitable solvent. The admixture is applied to the substrate by art known methods such as spin or spray coating, dipping or doctor blading. The film is heated to a temperature effective to bring about curing and thus provide a vitrified polymeric matrix, followed by further heating of the composition (to a higher temperature) or irradiation, in order to decompose the porogen and convert layer 10 to a dielectric material of the invention.

Referring to FIG. 6, the third step of the process involves lithographically patterning the layer 10 of dielectric composition to form trenches 12 (depressions) therein. The trenches 12 shown in FIG. 6 extend to the substrate 2 and to the metallic studs 8. Lithographic patterning generally involves: (i) coating the layer 10 of the dielectric material with a positive or negative photoresist such as those marketed by Shipley or Hoechst Celanese, (AZ photoresist); (ii) imagewise exposing (through a mask) the photoresist to radiation such as electromagnetic, e.g., UV, deep UV, vacuum UV, electron beam, etc.; (iii) developing the image in the resist, e.g., with suitable basic developer; and (iv) transferring the image through the layer 10 of dielectric composition to the substrate 2 with a suitable transfer technique such as reactive ion blanket or beam etching (RIE). Suitable lithographic patterning techniques are well known to those skilled in the art such as disclosed in Introduction to Microlithography, 2nd Ed., eds. Thompson et al. (Washington, D.C.: American Chemical Society, 1994).

Referring to FIG. 7, in the fourth step of the process for forming an integrated circuit of the present invention, a metallic film 14 is deposited onto the patterned dielectric layer 10. Preferred metallic materials include copper, tungsten, and aluminum. The metal is suitably deposited onto the patterned dielectric layer by art-known techniques such as chemical vapor deposition (CVD), plasma-enhanced CVD, electro and electroless deposition (seed-catalyzed in situ reduction), sputtering, or the like.

Referring to FIG. 8, the last step of the process involves removal of excess metallic material by “planarizing” the metallic film 14 so that the film is generally level with the patterned dielectric layer 10. Planarization can be accomplished using chemical/mechanical polishing or selective wet or dry etching. Suitable methods for chemical/mechanical polishing are known to those skilled in the art.

Referring to FIGS. 9–11, there is shown an alternative process for making an integrated circuit device of the invention. The first step of the process in this embodiment involves depositing a metallic film 16 onto a substrate 18. Substrate 18 is also provided with vertical metallic studs 20. Referring to FIG. 10, in the second step of the process, the metallic film is lithographically patterned through a mask to form trenches 22. Referring to FIG. 11, in the third step of the process, a layer 24 of a reaction mixture comprising the porogen, the host polymer, the coupling agent, and the selected solvent is deposited onto the patterned metallic film 16. In the last step of the process, the mixture is heated to crosslink the host polymer, followed by heating to a higher temperature effective to decompose the porogen. Optionally, the dielectric layer so provided may then be planarized, if necessary, for subsequent processing in a multilayer integrated circuit.

The invention additionally relates to an integrated circuit packaging device (multichip module) for providing signal and power current to one or more integrated circuit chips comprising: (i) a substrate having electrical conductor means for connection to a circuit board; (ii) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least of the layers comprises a film of a dielectric material of the present invention; and (iii) a plurality of vias for electrically interconnecting the electrical conductor means, conducting layers and integrated circuit chips.

The integrated circuit packaging device represents an intermediate level of packaging between the integrated circuit chip and the circuit board. The integrated circuit chips are mounted on the integrated circuit packaging device which is in turn mounted on the circuit board.

The substrate of the packaging device is generally an inert substrate such as glass, silicon or ceramic; suitable inert substrates also include epoxy composites, polyimides, phenolic polymers, high temperature polymers, and the like. The substrate can optionally have integrated circuits disposed therein. The substrate is provided with electrical conductor means such as input/output pins (I/O pins) for electrically connecting the packaging device to the circuit board. A plurality of electrically insulating and electrically conducting layers (layers having conductive circuits disposed in an dielectric insulating material) are alternatively stacked up on the substrate. The layers are generally formed on the substrate in a layer-by-layer process wherein each layer is formed in a separate process step.

The packaging device also comprises receiving means for receiving the integrated circuit chips. Suitable receiving means include pinboards for receipt of chip I/O pins or metal pads for solder connection to the chip. Generally, the packaging device also comprises a plurality of electrical vias generally vertically aligned to electrically interconnect the I/O pins, the conductive layers and integrated circuit chips disposed in the receiving means. The function, structure and method of manufacture of such integrated circuit packaging devices are well known to those skilled in the art, as disclosed, for example in U.S. Pat. Nos. 4,489,364, 4,508,981, 4,628,411 and 4,811,082.

It is to be understood that while the invention has been described in conjunction with the preferred specific embodiments thereof, that the foregoing description as well as the examples which follow are intended to illustrate and not limit the scope of the invention. Other aspects, advantages and modifications within the scope of the invention will be apparent to those skilled in the art to which the invention pertains.

All patents, patent applications, and publications mentioned herein are hereby incorporated by reference in their entireties.

Experimental

The following examples are put forth so as to provide those of ordinary skill in the art with a complete disclosure and description of how to prepare and use the oligomers and polymers disclosed and claimed herein. Efforts have been made to ensure accuracy with respect to numbers (e.g., quantities, temperature, etc.) but some errors and deviations should be accounted for. Unless indicated otherwise, parts are parts by weight, temperature is in ° C. and pressure is at or near atmospheric. Additionally, all starting materials were obtained commercially or synthesized using known procedures.

EXAMPLE 1

Comparison of Neat Resin Coatings with Coatings Prepared Using Polymeric Nitrogenous Porogens

Preparation of neat resin coatings: Twenty gm of solid glass resin was dissolved in 80 gm of propylene glycol methyl ether (PGME), propylene glycol methyl ether acetate (PGMEA), or propylene glycol n-propyl ether (PGn-PE) with vigorous shaking for 30 minutes. The clear solution was then filtered down to 0.2 microns employing Teflon membrane filters or propylene filter cartridges. The filtered solution was then spin coated onto clean Si wafers using the following procedure: Approximately 0.5 mL of resin solution was deposited in the center of a 2 inch wafer and the substrate spun at 1000 rpm for 5 seconds to evenly spread the solution across the wafer surface. The speed was then increased to 3000 rpm for 30 seconds followed by a backside rinse of the substrate at 1000 rpm for 3 seconds and a final drying step at 3000 rpm for 10 seconds. The sample was then placed on a hot plate maintained at 100° C. for 5 minutes. Upon ramping up the temperature at 3–5° C./minute, “volcano” defects generally appeared at approximately 150° C. Alternatively, the soft baked sample is then heated in a controlled atmosphere oven at 450° C. for 2 hours using a ramp-up of 3° C./minute. Upon cooling, identical volcano defects were observed.

Coatings prepared with methyl silsesquioxane (MSSQ) and a polymeric nitrogenous porogen: A formulation with an intended porosity of approximately 20 percent was prepared by mixing 8.0 gm of a 20 wt % glass resin solution with 2.0 gm of a 20 wt % poly(methylmethacrylate-co-N,N-dimethylaminoethyl methacrylate)(poly(MMA-DMAEM), 3:1 MMA:DMAEM)) solution. The preferred solvents for both the organosilicate resin and the pore generating polymer are PGME and PGn-PE. The resulting mixture was filtered down to 0.2 microns, and a spin coating procedure was used identical to that described in part (a). The coated substrate was then placed on a hot plate maintained at 100° C. for 5 minutes. Following the soft bake step, the substrate was then heated in a controlled atmosphere oven at 450° C. for 2 hours using a ramp-up rate of 3° C./minute.

FIG. 1 is a high magnification optical photomicrograph of the coating prepared in part (b), using the method of the invention. As may be seen, the coating is virtually defect-free. By contrast, the optical photomicrographs of the coating prepared in part (a) show substantial defects. FIGS. 2A and 2B are high magnification and low magnification optical photomicrographs, respectively, that illustrate the defects in a coating of the neat MSSQ resin near the edge of the wafer, while FIG. 2C is a high magnification optical photomicrograph illustrating the coating defects at the center of a wafer.

EXAMPLE 2

Viscosity Evaluation

Sixteen gm of a methyl silsesquioxane solution, 18 wt % solids, in PGMEA was mixed with 4.0 gm of a corresponding 18 wt % solution in the identical solvent containing the nitrogenous porogen P(MMA-DMAEM)(3:1 MMA:DMAEM) or an amine-equivalent, low molecular weight material, i.e., dimethylaminoethyl isobutyrate and dimethylaminoethanol. The nitrogenous porogen and the amines represented 1 wt. % based on the MSSQ. The solutions were then introduced into a size 75 calibrated Cannon-Ubbelohde viscometer equipped with an electric timing sensor and provisions to seal the measuring tube in between measurements. The filled viscometer was then placed in a thermostated water bath maintained at 25±0.1° C. Elution times ranged from hours to days, depending on the relative rate of increase in the solution viscosity prior to gelation. Typically, five elution time readings were averaged. The average elution time was then multiplied by the viscometer calibration constant to yield the solution viscosity in centipoise. Results are illustrated in graph form in FIG. 3. As may be seen, with dimethylaminoethanol as the additive, the MSSQ resin gelled within several hours. With dimethylaminoethyl isobutyrate, gleation did not occur as quickly; however, due to the presence of small gel particles, film quality deteriorated within several days. Only the polymeric base, P(MMA-DMAEM), showed very little effect on the MSSQ resin. This was extremely surprising since the basicity of the pendant dimethylaminoethyl group is similar to that of the two low molecular weight bases that were used. 

1. A dielectric material comprised of a highly porous polymeric matrix of an organic silicate and a nitrogenous polymer having pores with an average pore size less than about 500 Å in diameter, a void percentage in the range of approximately 65% to approximately 95%, and a dielectric constant of less than about 2.5.
 2. The dielectric material of claim 1, having closed cell pores less than about 200 Å in diameter.
 3. The dielectric material of claim 2, having closed cell pores less than about 100 Å in diameter.
 4. The dielectric material of claim 3, having a void percentage in the range of approximately 70% to approximately 95%.
 5. The dielectric material of claim 2, having a void percentage in the range of approximately 70% to approximately 95%.
 6. The dielectric material of claim 1, having a void percentage in the range of approximately 70% to approximately 95%.
 7. The dielectric material of claim 1, having a dielectric constant of less than about 2.0.
 8. A substrate having a dielectric layer on a surface thereof, wherein the dielectric layer is comprised of the dielectric material of claim
 1. 9. An integrated circuit device comprised of a substrate, individual metallic circuit lines positioned on the substrate, and a dielectric composition positioned over and/or between the individual metallic circuit lines, the dielectric composition comprised of the dielectric material of claim
 1. 10. An integrated circuit packaging device for providing signal and power current to an integrated circuit chip, the packaging device comprising (a) a substrate having electrical conductor means for connection to a circuit board, (b) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least one of the electrically insulating layers is comprised of a dielectric coating comprised of the dielectric material of claim 1, and (c) a plurality of vias for electrically interconnecting the electrical conductor, the conducting layers and the integrated circuit chip. 